Through Glass Via (TGV) Substrate Research：CAGR of 22.6% during the forecast period

A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). This report studies the TGV substrate (TGV wafer).

Source: Secondary Sources and QYResearch, 2021

According to the new market research report “Global Through Glass Via (TGV) Substrate Market Report 2023-2029”, published by QYResearch, the global Through Glass Via (TGV) Substrate market size is projected to reach USD 0.29 billion by 2029, at a CAGR of 22.6% during the forecast period.

• Global Through Glass Via (TGV) Substrate MarketSize(US$ Million), 2018-2029

Based on or includes research from QYResearch: Global Through Glass Via (TGV) Substrate Market Report 2023-2029.

• Global Through Glass Via (TGV) Substrate Top5Players Ranking and Market Share（Based on data of 2021, Continually updated）

Based on or includes research from QYResearch: 2021 data information of Global Through Glass Via (TGV) Substrate Market Report 2023-2029.

The global key manufacturers of Through Glass Via (TGV) Substrate include Corning, LPKF, Samtec, Kiso Micro Co.LTD, Tecnisco, Microplex, Plan Optik, NSG Group, Allvia, Company 10, etc. In 2021, the global top five players had a share approximately 74.0% in terms of revenue.

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