Global 3D Stacked IC’s Market Research Report 2018 Analysis and Forecast to 2022

The Global 3D IC’s market, by technology type statistical report, published by Market Research Future contains succinct information on the 3D IC’s market, segmented by technology type (3D stacked IC’s, Monolithic 3D IC’s) and forecast from 2016-2022. The factors driving the 3D IC’s market are Increasing demand for advanced electronic product driving semiconductor industry to innovate packaging technology, and high demand for 3D packaging using TSVs.
3D stacked ICs is a multiple die stacking technique manufactured by mounting logic gates, silicon wafers and dies on a single multi-layer substrate through silicon vias (TSVs). There are majorly three stacking approaches namely die-to die, die-to-wafer, and wafer-to-wafer. In die-to die stacking method electronic component are built on multiple die.
3D Stacked IC’s is expected to grow with 16% CAGR during forecast period 2016-2022
 
Table of Contents
1.    Info graphics Information
1.1    3D stacked IC’s Market, by Region, 2016-2022 (USD Million)
2.    3D stacked IC’s Market, by Region Market Data
 
List of Tables
Table 1       3D stacked IC’s Market, by Region 2016-2022 (USD Million)
 
List of Figures
Figure 1   3D stacked IC’s Market, by Region 2016-2022 (USD Million)
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