Global 3D IC and 2.5D IC Market Size,Growth Rate,Industry Opportunities 2024-2030

According to our (Global Info Research) latest study, the global 3D IC and 2.5D IC market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.

In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.While a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.

Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.

The Global Info Research report includes an overview of the development of the 3D IC and 2.5D IC industry chain, the market status of Consumer Electronics (3D Wafer-level Chip-scale Packaging, 3D TSV), Telecommunication (3D Wafer-level Chip-scale Packaging, 3D TSV), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of 3D IC and 2.5D IC.

Regionally, the report analyzes the 3D IC and 2.5D IC markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global 3D IC and 2.5D IC market, with robust domestic demand, supportive policies, and a strong manufacturing base.

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Market Segmentation

3D IC and 2.5D IC market is split by Type and by Application. For the period 2019-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.

Market segment by Type

    3D Wafer-level Chip-scale Packaging

    3D TSV

    2.5D

Market segment by Application

Major players covered

    TSMC(Taiwan)

    Samsung(South Korea)

    Toshiba(Japan)

    ASE Group(Taiwan)

    Amkor(U.S.)

    UMC(Taiwan)

    Stmicroelectronics(Switzerland)

    Broadcom(U.S.)

    Intel(U.S.)

    Jiangsu Changjiang Electronics(China)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe 3D IC and 2.5D IC product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of 3D IC and 2.5D IC, with price, sales, revenue and global market share of 3D IC and 2.5D IC from 2019 to 2024.

Chapter 3, the 3D IC and 2.5D IC competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the 3D IC and 2.5D IC breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2023.and 3D IC and 2.5D IC market forecast, by regions, type and application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of 3D IC and 2.5D IC.

Chapter 14 and 15, to describe 3D IC and 2.5D IC sales channel, distributors, customers, research findings and conclusion.

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Global Perspective: Our research team has a strong understanding of the company in the global 3D IC and 2.5D IC market.Which offers pragmatic data to the company.

Aim And Strategy: Accelerate your business integration, provide professional market strategic plans, and promote the rapid development of enterprises.

Innovative Analytics: We have the most comprehensive database of resources , provide the largest market segments and business information.

About Us:

Global Info Research is a company that digs deep into global industry information to support enterprises with market strategies and in-depth market development analysis reports. We provide market information consulting services in the global region to support enterprise strategic planning and official information reporting, and focuses on customized research, management consulting, IPO consulting, industry chain research, database and top industry services. At the same time, Global Info Research is also a report publisher, a customer and an interest-based suppliers, and is trusted by more than 30,000 companies around the world. We will always carry out all aspects of our business with excellent expertise and experience.

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