Die Attach Materials Market is expected to reach USD 648.7 Million by the end of 2029: Cognitive Market Research

Typical die-attach materials are PbSn, PbSnAg or PbInAg alloys. These alloys wet conventional substrates and die metallizations due to the formation of intermetallic compounds, which build an adhesion layer between substrate or die metallization and bulk solder. To achieve the best wetting and lowest void rate, the solder material should contain the lowest possible oxide content. The die-attach layer has two main functions: mechanical fixation of the die on its substrate, and dissipation of heat generated in the die. Especially in power and high-power applications, generated heat density is high. Therefore, conventional die-attach adhesives or eutectic solder alloys are not suitable as die-attach materials. For these applications, high-melting solder alloys are used, which contain more than 85% lead by weight, and do not satisfy the requirements of RoHS. Since there is no established lead-free substitute on the market, high-lead alloys are included on the exemption list of RoHS for these applications. However, die-attach materials that satisfy the requirements of RoHS do exist.

Tip: It should be noted that the solder paste and tin wire used in the PCB of the electronics industry are not included in the statistical scope of the report because this part of the product is mainly used for the soldering of electronic components rather than the soldering of chips. According to QYR's investigation, with the increase of SMT equipment, die-attach wires used for die-attach materials are becoming less and less, and die-attach wires are mainly used in the electronics manufacturing industry instead of chip bonding.

LPI (LP Information)' newest research report, the “Die Attach Materials Industry Forecast” looks at past sales and reviews total world Die Attach Materials sales in 2022, providing a comprehensive analysis by region and market sector of projected Die Attach Materials sales for 2023 through 2029. With Die Attach Materials sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Die Attach Materials industry.

This Insight Report provides a comprehensive analysis of the global Die Attach Materials landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Die Attach Materials portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Die Attach Materials market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Die Attach Materials and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Die Attach Materials.

The global Die Attach Materials market size is projected to grow from US$ 557.9 million in 2022 to US$ 648.7 million in 2029; it is expected to grow at a CAGR of 648.7 from 2023 to 2029.

The major players in global Die-Attach Materials market include Alpha Assembly Solutions, SMIC, Shenmao Technology, etc. The top 3 players occupy about 40% shares of the global market. Asia Pacific and North America are main markets, they occupy about 90% of the global market. Die Attach Paste is the main type, with a share about 85%. SMT Assembly is the main application, which holds a share about 50%.

This report presents a comprehensive overview, market shares, and growth opportunities of Die Attach Materials market by product type, application, key manufacturers and key regions and countries.

Top Manufactures in Global Die Attach Materials Includes:

    Alpha Assembly Solutions

    SMIC

    Henkel

    Shenmao Technology

    Heraeu

    Shenzhen Weite New Material

    Sumitomo Bakelite

    Indium

    AIM

    Tamura

    Kyocera

    TONGFANG TECH

    NAMICS

    Hitachi Chemical

    Nordson EFD

    Asahi Solder

    Dow

    Shanghai Jinji

    Inkron

    Palomar Technologies

Market Segment by Type, covers:

    Die Attach Paste

    Die Attach Wire

    Others

Market Segment by Applications, can be divided into:

    SMT Assembly

    Semiconductor Packaging

    Automotive

    Medical

    Others

Key Questions Addressed in this Report

What is the 10-year outlook for the global Die Attach Materials market?

What factors are driving Die Attach Materials market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Die Attach Materials market opportunities vary by end market size?

How does Die Attach Materials break out type, application?

What are the influences of COVID-19 and Russia-Ukraine war?

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https://www.lpinformationdata.com/reports/457244/die-attach-materials-2029

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