Flip Chip Technologies Market 2018: Global Analysis by Key Players – Samsung, ASE group, Powertech Technology, Intel, Amkor

Flip Chip Technologies Market 2018

This report studies the global Flip Chip Technologies market status and forecast, categorizes the global Flip Chip Technologies market size (value & volume) by manufacturers, type, application, and region. This report focuses on the top manufacturers in United States, Europe, China, Japan, South Korea and Taiwan and other regions.
Flip chip is the technique for interconnecting semiconductor devices, such as IC chips, to external circuitry with solder bumps that have been dumped onto the chip pads. 

The major manufacturers covered in this report 
Samsung Electronics 
ASE group 
Powertech Technology 
United Microelectronics Corporation 
Intel Corporation 
Amkor Technology 
TSMC 
Jiangsu Changjiang Electronics Technology 
Texas Instruments 
Siliconware Precision Industries
 

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Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering 
United States 
EU 
China 
Japan 
South Korea 
Taiwan

On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into 
Copper Pillar 
Solder Bumping 
Tin-lead eutectic solder 
Lead-free solder 
Gold Bumping 
Other 

On the basis of the end users/applications, this report focuses on the status and outlook for major applications/end users, consumption (sales), market share and growth rate for each application, including 
Electronics 
Industrial 
Automotive &Transport 
Healthcare 
IT & telecommunication 
Aerospace and Defence 
Other
 

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Table of Contents –Analysis of Key Points

Global Flip Chip Technologies Market Research Report 2018 
1 Flip Chip Technologies Market Overview 
1.1 Product Overview and Scope of Flip Chip Technologies 
1.2 Flip Chip Technologies Segment by Type (Product Category) 
1.2.1 Global Flip Chip Technologies Production and CAGR (%) Comparison by Type (Product Category)(2013-2025) 
1.2.2 Global Flip Chip Technologies Production Market Share by Type (Product Category) in 2017 
1.2.3 Copper Pillar 
1.2.4 Solder Bumping 
1.2.5 Tin-lead eutectic solder 
1.2.6 Lead-free solder 
1.2.7 Gold Bumping 
1.2.8 Other 
1.3 Global Flip Chip Technologies Segment by Application 
1.3.1 Flip Chip Technologies Consumption (Sales) Comparison by Application (2013-2025) 
1.3.2 Electronics 
1.3.3 Industrial 
1.3.4 Automotive &Transport 
1.3.5 Healthcare 
1.3.6 IT & telecommunication 
1.3.7 Aerospace and Defence 
1.3.8 Other 
1.4 Global Flip Chip Technologies Market by Region (2013-2025) 
1.4.1 Global Flip Chip Technologies Market Size (Value) and CAGR (%) Comparison by Region (2013-2025) 
1.4.2 United States Status and Prospect (2013-2025) 
1.4.3 EU Status and Prospect (2013-2025) 
1.4.4 China Status and Prospect (2013-2025) 
1.4.5 Japan Status and Prospect (2013-2025) 
1.4.6 South Korea Status and Prospect (2013-2025) 
1.4.7 Taiwan Status and Prospect (2013-2025) 
1.5 Global Market Size (Value) of Flip Chip Technologies (2013-2025) 
1.5.1 Global Flip Chip Technologies Revenue Status and Outlook (2013-2025) 
1.5.2 Global Flip Chip Technologies Capacity, Production Status and Outlook (2013-2025)
………

7 Global Flip Chip Technologies Manufacturers Profiles/Analysis 
7.1 Samsung Electronics 
7.1.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 
7.1.2 Flip Chip Technologies Product Category, Application and Specification 
7.1.2.1 Product A 
7.1.2.2 Product B 
7.1.3 Samsung Electronics Flip Chip Technologies Capacity, Production, Revenue, Price and Gross Margin (2013-2018) 
7.1.4 Main Business/Business Overview 
7.2 ASE group 
7.2.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 
7.2.2 Flip Chip Technologies Product Category, Application and Specification 
7.2.2.1 Product A 
7.2.2.2 Product B 
7.2.3 ASE group Flip Chip Technologies Capacity, Production, Revenue, Price and Gross Margin (2013-2018) 
7.2.4 Main Business/Business Overview 
7.3 Powertech Technology 
7.3.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 
7.3.2 Flip Chip Technologies Product Category, Application and Specification 
7.3.2.1 Product A 
7.3.2.2 Product B 
7.3.3 Powertech Technology Flip Chip Technologies Capacity, Production, Revenue, Price and Gross Margin (2013-2018) 
7.3.4 Main Business/Business Overview 
7.4 United Microelectronics Corporation 
7.4.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 
7.4.2 Flip Chip Technologies Product Category, Application and Specification 
7.4.2.1 Product A 
7.4.2.2 Product B 
7.4.3 United Microelectronics Corporation Flip Chip Technologies Capacity, Production, Revenue, Price and Gross Margin (2013-2018) 
7.4.4 Main Business/Business Overview 
7.5 Intel Corporation 
7.5.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 
7.5.2 Flip Chip Technologies Product Category, Application and Specification 
7.5.2.1 Product A 
7.5.2.2 Product B 
7.5.3 Intel Corporation Flip Chip Technologies Capacity, Production, Revenue, Price and Gross Margin (2015-2018) 
7.5.4 Main Business/Business Overview 
7.6 Amkor Technology 
7.6.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 
7.6.2 Flip Chip Technologies Product Category, Application and Specification 
7.6.2.1 Product A 
7.6.2.2 Product B 
7.6.3 Amkor Technology Flip Chip Technologies Capacity, Production, Revenue, Price and Gross Margin (2013-2018) 
7.6.4 Main Business/Business Overview 
7.7 TSMC 
7.7.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 
7.7.2 Flip Chip Technologies Product Category, Application and Specification 
7.7.2.1 Product A 
7.7.2.2 Product B 
7.7.3 TSMC Flip Chip Technologies Capacity, Production, Revenue, Price and Gross Margin (2013-2018) 
7.7.4 Main Business/Business Overview 
Continued…..
 
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