Power Supply In Package and Power Supply On Chip Market Size, Share, Trends, and Forecast to 2032 – Growing at a CAGR of 6.64%

The Power Supply In Package (PSiP) and Power Supply On Chip (PwrSoC) Market technologies have become essential in addressing the rising demand for compact and energy-efficient electronic solutions. With increasing pressure on device manufacturers to minimize form factors without compromising on performance, PSiP and PwrSoC offer high integration levels while enhancing power density and system efficiency.

Market Overview

• Market Size 2023: USD 25.46 Billion
• Market Size 2024 (Base Year): USD 27.15 Billion
• Market Size 2032 (Forecast): USD 45.39 Billion
• CAGR (2024–2032): 6.64%

This strong growth trajectory is attributed to expanding applications in consumer electronics, automotive, telecom, and industrial automation sectors. The integration of power modules at the chip or package level supports design simplification, cost reduction, and enhanced thermal performance.

Key Market Dynamics

Rising Demand for Compact Devices - The continued trend towards miniaturization in smartphones, wearables, medical devices, and other portable electronics has spurred demand for PSiP and PwrSoC technologies. These solutions help manufacturers meet space and power efficiency requirements simultaneously.

Advancements in Packaging Technology - Ongoing innovations in semiconductor packaging—such as 3D packaging, wafer-level integration, and heterogeneous integration—are enhancing the feasibility and performance of PSiP and PwrSoC modules, expanding their use in advanced systems.

Growing Adoption in Portable Electronics - With the surge in demand for mobile and battery-powered devices, the need for integrated and efficient power management solutions continues to grow. PwrSoC offers high performance while occupying minimal board space, making it ideal for these devices.

Increasing Demand in Automotive and Industrial Applications - The shift toward electric vehicles (EVs), hybrid powertrains, and industrial IoT systems has led to a significant increase in the demand for compact and robust power management solutions that PSiP and PwrSoC can deliver.

Regulatory Standards and Environmental Concerns - Global initiatives to improve energy efficiency and reduce electronic waste are encouraging the adoption of integrated power solutions. Compliance with these evolving standards is promoting innovation and market expansion.

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Key Market Opportunities

• 5G Deployment: Accelerates demand for compact, low-noise, high-efficiency power solutions for small cells and base stations.
• AI and Machine Learning Integration: Requires power-dense solutions for GPUs and custom AI chips.
• Miniaturization Trend: Across healthcare, consumer tech, and aerospace industries.
• IoT Expansion: Drives growth in sensor networks, edge devices, and connected infrastructure.
• Automotive Electrification: EV powertrains, infotainment systems, and ADAS create substantial opportunities.

Market Segmentation

By Power Type:

• Low Power
• Medium Power
• High Power

By Technology:

• Power Supply In Package (PSiP)
• Power Supply On Chip (PwrSoC)

By Isolation:

• Isolated
• Non-Isolated

By Package Type:

• 2D
• 2.5D
• 3D

By Region:

• North America: High adoption of advanced consumer and automotive electronics
• Europe: Emphasis on energy efficiency and EV development
• APAC: Leading region with strong semiconductor manufacturing base (especially China, Japan, South Korea)
• South America & MEA: Gradual uptake with emerging industrial and telecom sectors

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Competitive Landscape

The market is moderately consolidated with global semiconductor leaders investing heavily in power integration technologies. Key players include:

• Murata Manufacturing Co., Ltd.
• Texas Instruments Incorporated
• ON Semiconductor Corporation
• Qualcomm Technologies, Inc.
• STMicroelectronics
• Analog Devices, Inc.
• Infineon Technologies AG
• ROHM Semiconductor
• Diodes Incorporated
• NXP Semiconductors N.V.
• Toshiba Corporation
• Vicor Corporation
• Monolithic Power Systems, Inc.
• Power Integrations, Inc.
• Wolfspeed, Inc.

These companies are focusing on product innovation, R&D, and strategic partnerships to capture market share and respond to evolving demand for high-performance integrated power solutions.

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