Global Semiconductor Packaging and Assembly Equipments Industry Research Report, Growth Trends and Competitive Analysis 2018-2025

In terms of production side, this report researches the Semiconductor Packaging and Assembly Equipments capacity, production, value, ex-factory price, growth rate, market share for major manufacturers, regions (or countries) and product type.

In terms of consumption side, this report focuses on the consumption of Semiconductor Packaging and Assembly Equipments by regions and application. The key regions like North America, Europe, Asia-Pacific, Central & South America, Middle East and Africa etc.

For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing, wire bonding, and die bonding. This entire process is known as semiconductor packaging and assembly, which is the back-end process of chip formation.

The die-level packaging and assembly equipment segment to be the major revenue contributing segment in this market during the forecasted period.

The APAC region to continue dominating this market during the forecast period. This region currently accounts for more than 65% of the total revenue share. The presence of leading semiconductor foundries in this region, such as Taiwan Semiconductor Manufacturing, United Microelectronics, Samsung, and Semiconductor Manufacturing International, is expected to impel market growth during the forecast period.

The Semiconductor Packaging and Assembly Equipments market was valued at xx Million US$ in 2017 and is projected to reach xx Million US$ by 2025, at a CAGR of xx% during the forecast period. In this study, 2017 has been considered as the base year and 2018 to 2025 as the forecast period to estimate the market size for Semiconductor Packaging and Assembly Equipments.

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This report includes the following manufacturers; we can also add the other companies as you want.

•     Applied Materials
•     ASMPT
•     DISCO Corporation
•     EV Group
•     Kulicke and Soffa Industries
•     TEL
•     Tokyo Seimitsu
•     Rudolph Technologies
•     SEMES
•     Suss Microtec
•     Ultratech
•     Ulvac Technologies

Market Segment by Product Type

•     Die- Level Packaging and Assembly Equipment
•     Wafer-Level Packaging and Assembly Equipment

Market Segment by Application

•     IDM (Integrated Device Manufacturers)
•     OSAT (Outsourced Semiconductor Assembly and Test Companies)

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QY Research established in 2007, focus on custom research, management consulting, IPO consulting, industry chain research, data base and seminar services. The company owned a large basic data base (such as National Bureau of statistics database, Customs import and export database, Industry Association Database etc), expert’s resources (included energy automotive chemical medical ICT consumer goods etc.